E6 Claims Its Groundbreaking Copper-Diamond Heatsinks Will Keep Chips Chill
A De Beers subsidiary claims that it can manufacture composite heatsinks with insane thermal conductivity in complex shapes.
Princeton University10y
Tungsten, W
Tungsten has a Young's modulus of 407 GPa, a yield stress of 1.516 GPa, and a UTS of 1.516 GPa. The linear coefficient of thermal expansion is 4.59 m/m/K and the thermal conductivity is 1.73 W/cm/K.
Princeton University10y
Zirconium, Zr
a yield stress of 310 MPa, and a UTS of 448 MPa. The linear coefficient of thermal expansion is 10.44 m/m/K and the thermal conductivity is 0.227 W/cm/K ...
world-nuclear-news3d
New material proposed in TRT tokamak project
Specialists at JSC NIIEFA and MISIS have developed a composite of tungsten and copper, using additive technologies, for the ...