Thermal Grizzly releases Duronaut high-performance thermal paste with exceptional long-term stability, ready to keep your CPU ...

Diamond-silicon carbide (SiC) composite materials are gaining attention in various industrial applications due to their exceptional thermal and mechanical properties. These composites combine the ...

Wide bandgap materials and advanced packaging are revolutionizing power, but thermal and integration challenges persist.

Assembly design kits will greatly increase efficiency, but custom methods prevail for now. Process design kits (PDKs) play an ...

SiC and GaN advances used improved device structures and higher levels of integration to support higher voltages and power ...

Researchers have built a deep-ultraviolet microscope to study hard-to-analyze materials like diamond, offering a new way to ...

In today’s rapidly advancing technological landscape, electronic materials are the foundation of countless devices and systems that power our daily lives. From smartphones and laptops to advanced ...

Dutch startup Arceon is working with industry leaders to test its Carbeon CMC, targeting UHTCMC and a presence in the U.S. in ...

Ultrawide-bandgap semiconductors—such as diamond—are promising for next-generation electronics due to a larger energy gap ...