TSMC is entering an unprecedented growth phase, driven by accelerating AI infrastructure demand. Check out why I reiterate a ...

Due to its compatibility with next-generation 3D NAND memory, the Phison E28 controller will enable SSDs with capacities of ...

Ceva, Inc. unveiled the Ceva-Waves Links200, the first turnkey multi-protocol platform IP to support next-generation ...

CEVA-Waves Links200 turnkey multi-protocol platform IP supports next generation Bluetooth High Data Throughput (HDT) ...

Phison unveils PS5031-E31T PCIe Gen5 SSD controller for the mainstream market and the world's first native USB4 SoC, the ...

Multi-protocol wireless connectivity platform Credit: Michael - adobe.stock.com Integrating a new Ceva-developed radio designed for TSMC's low power 12nm process, the Links200 solution removes ...

Ceva Inc. unveiled the Ceva-Waves Links200, the first complete turnkey multi-protocol platform IP to support next-gen ...

Ceva has added Bluetooth High Data Throughput (HDT) to IEEE 802.15.4 for Zigbee, Thread and Matter in radio intellectual property aimed at TSMC’s FFC+ 12nm finfet semiconductor process. “Ceva-Waves ...

The latest information from insiders claimed that TSMC is struggling with wafer yield, and the 2nm chips have yet to be certified for mass production. There is too much demand for test products ...

TL;DR: TSMC has begun mass production at its first fab in Japan, focusing on 12nm to 28nm logic chips for cars and image sensors. The Japanese government, aiming to strengthen its semiconductor ...

TSMC has commenced mass production at its fab ... which will mostly address automakers with 12nm, 16nm, 22nm, and 28nm-class process technologies.

The Japanese government has agreed to offer more than 1 trillion yen ($6.3 billion) in subsidies to TSMC. It sees domestic chip production as critical for its economic security as heavy dependence on ...